PART |
Description |
Maker |
GSM31P256KB-I66 GSM31P512KB-I66 |
x64 Interleaved Burst Mode SRAM Module 256KB Secondary Cache Module Designed For Use With Intel Pen-tium CPU based system(用于英特尔奔腾处理器系统56KB二级高速缓冲存储器) 512KB Secondary Cache Module Designed For Use With Intel Pen-tium CPU based system(用于英特尔奔腾处理器系统12KB二级高速缓冲存储器)
|
GSI Technology
|
ECWU1104V33 ECWU1105KCV ECWU1184KC9 ECWU1224KC9 EC |
Stacked Metallized PEN Film Chip Capacitor
|
Panasonic Semiconductor
|
FCN3022A394K-X FCN2416A104K-D1 FCN2820A224K-Z FCN2 |
Stable Stacked Metallized Film (PEN) Chips for Reflow Soldering Stable Stacked Metallized Film (PEN) Chips for Reflow Soldering
|
List of Unclassifed Manufacturers List of Unclassifed Manufac... List of Unclassifed Man...
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LDECA2120KA0N00 |
LDE, Film, Metallized PEN Stacked, Automotive Grade, 0.012 uF, 10%, 50 V, 40 VAC, 125C, 1206, 1.1mm
|
Kemet Corporation
|
LDECB2390JA0N00 |
LDE, Film, Metallized PEN Stacked, Automotive Grade, 0.039 uF, 5%, 50 V, 40 VAC, 125C, 1210, 2.1mm
|
Kemet Corporation
|
LDECA1330MA0N00 |
LDE, Film, Metallized PEN Stacked, Automotive Grade, 3300 pF, 20%, 50 V, 40 VAC, 125C, 1206, 1.2mm
|
Kemet Corporation
|
HEF4006B HEF4006BD HEF4006BF HEF4006BN HEF4006BP H |
Bonkote Re-Usable Flux Dispensing Pen; RoHS Compliant: NA 18-stage static shift register 18级静态移位寄存器
|
PHILIPS[Philips Semiconductors] NXP Semiconductors N.V.
|
LDEIC2220KA0N00 |
Film, Metallized PEN Stacked, Commercial Grade, LDE, 0.022 uF, 10%, 250 V, 120 V, 125C, 1812, 2.2mm
|
Kemet Corporation
|
LDEIC2100KA5N00 |
LDE, Film, Metallized PEN Stacked, Automotive Grade, 0.01 uF, 10%, 250 V, 120 VAC, 125C, 1812, 1.7mm
|
Kemet Corporation
|
LDECB2470KA0N00 |
Film, Metallized PEN Stacked, Commercial Grade, LDE, 0.047 uF, 10%, 50 V, 40 V, 125C, 1210, 2.1mm
|
Kemet Corporation
|
|